How does it work?
Semiconductor Metrology System
Undoubtedly an essential measurement tool for process automation, quality control and tool automation control.
Measures Thickness, TTV, Bow, Warp, Site and Global Flatness
The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness. User-defined and ASTM/SEMI compliant scan patterns are used to generate full 3-dimensional (3D) wafer images.
Customized data reports are available for viewing tabular data of each wafer measured with quick, easy export to your spreadsheet program.
- Wafer Specifications Diameter: 150 mm, 200 mm, 300 mm
- Material: All semiconducting and semi-insulating wafers including Si, GaAs, Ge, SiC, InP
- Surfaces: As-Cut, Lapped, Etched, Polished, Patterned
- Flat/Notch: All SEMI Standard Flat(s) or Notch
- Conductivity: P or N Type
Thickness and Bow of all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and sapphire or tape
The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent electrical ground resulting in exceptional accuracy and repeatability for most wafer types. The Proforma 300i system includes full remote control operating software and Ethernet network interface capability.
*Gallium-Arsenide requires probe reconfiguration for semi-insulating materials over 10K-Ohm cm bulk resistance
Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.
Proforma PV-1000 High-speed, multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.