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Capacitance Probes

Semiconductor Metrology Systems

MTI Instruments' semiconductor metrology tools consist of a complete line of wafer measurement systems for virtually any material including Si, GaAs, Ge and InP. From manual to fully automated systems, the Proforma line of wafer tools are ideal for measuring wafer thickness, bow, warp, resistivity, site and global flatness. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII's solar metrology tools include off line manual systems for wafer thickness and TTV, as well as, in-process measurement systems capable of measuring wafer thickness, TTV and bow at the speed of 5 wafers/second.


Proforma 300

   

Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.


Proforma 200SA

  

Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness. The Proforma 200SA can be used for all wafer materials and accommodates wafer diameters of 75 - 200 mm.


Proforma 300SA

 

Semi-automated wafer characterization system for measuring wafer thickness, TTV, bow warp, site and global flatness. The Proforma 300SA can be used for all wafer materials and accommodates 200mm and 300mm wafer diameters.


PV1000

 

High-speed, multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.