Download the Vacuum Wand Overview
Semiconductor Silicon Wafer Handling Tools
Vacuum Wand for Semiconductor Wafer Processing
Our unique valve* ensures reliable suction and release of a semiconductor wafer.
The well polished inner wall of the valve part minimizes particle generation.
The optically polished wafer tip provides excellent adhesion to a wafer.
The wand body can be easily detached from the tubing.
*US Patent 6176265, Japanese Patents 1698352 and 1885465
You can find the wand which meets your requirements on our interactive catalog.
C series for ESD protection
The body covered with Conductive Nylon reduces electrostatic effects towards a wafer.
The wafer tip is made of Conductive PEEK (Polyetheretherketon).
The resistance value of 106 to 108 ohms provides optimum static protection.
For 5, 6, 8 and 12-inch wafer handling
F series Teflon(R) body
The body is made of Teflon(R) for chemical resistance.
A large selection of wafer tips available.
For 2-3, 4, 5, 6, 8 and 12-inch wafer handling
Manual Wand for Semiconductor Wafer Handling
Our unique design (Patent Pending) ensures to handle a delicate and fragile semiconductor wafer softly but firmly without excessive touch.
The surfaces of a wafer are never scratched in contrast to conventional metal tweezers.
The area that contacts wafer surfaces is optically-polished to reduce surface particle counts.
L series no metal contamination
Withstands up to 130C continuously
For 4, 5, 6, 8 and 12-inch wafer handling
No glue or metal parts
PEEK, PPS and Conductive PEEK materials available
